emc
EMC Pre-Compliance Skill
Automated EMC risk analysis for KiCad PCB designs. Identifies the most common causes of EMC test failures using geometric rule checks, analytical emission formulas, and optional SPICE simulation.
This is a risk analyzer, not a compliance predictor. It catches ~70% of common EMC design mistakes before fabrication. It cannot guarantee FCC/CISPR compliance — only a calibrated measurement in an accredited lab can do that. But it can reduce the first-spin failure rate from ~50% toward ~20-30%, potentially saving $5K-$50K per avoided board respin.
Related Skills
| Skill | Purpose |
|---|---|
kicad |
Schematic/PCB analysis — produces the analyzer JSON this skill consumes |
kicad (thermal) |
Thermal hotspot analysis — MLCC derating and ferrite/inductor overheating findings can amplify EMC decoupling and filter issues (an over-stressed MLCC degrades; a hot ferrite drifts impedance). Worth cross-checking when EMC flags DC-001/DC-002 or EF-001/EF-002. |
spice |
SPICE simulation — provides simulator backend for SPICE-enhanced PDN/filter checks |
Handoff guidance: Run the kicad skill's analyze_schematic.py and analyze_pcb.py first — this skill consumes their JSON output. Use --full on the PCB analyzer for best results (enables per-track coordinates for ground plane crossing, edge proximity, and return path checks). During a design review, run EMC analysis after the schematic/PCB analyzers, SPICE simulation, and thermal analysis, then incorporate EMC findings into the report.