hardware-design
Fail
Audited by Snyk on Jun 13, 2026
Risk Level: HIGH
Full Analysis
MEDIUM W011: Third-party content exposure detected (indirect prompt injection risk).
- Third-party content exposure detected (high risk: 0.85). The required runtime workflow calls public third-party HTTP APIs (e.g.,
https://www.eda.cn/.../queryPageandhttps://smtapi.nextpcb.com/.../bom/inquiry) and ingests their JSON responses as readable text/fields into the agent’s context, which is outsider-authored free-form content.
HIGH W008: Secret detected in skill content (API keys, tokens, passwords).
- Secret detected (high risk: 1.00). I inspected the script for literal credentials. The stock_params block contains:
- appid: "j1LWf238" — likely an application identifier (lower entropy but used as a credential).
- timestamp: "1681810983" — an epoch timestamp (not a secret).
- signature: "8e02b899be91b77dc140dfc2388dde95" — a long, random-looking hex string consistent with an API signature or secret.
The signature is high-entropy and appears to be a real API signing credential sent to smtapi.nextpcb.com, so it meets the definition of a secret. No other high-entropy secrets or private keys are present. This is not a documentation placeholder or a simple setup password.
Issues (2)
W011
MEDIUMThird-party content exposure detected (indirect prompt injection risk).
W008
HIGHSecret detected in skill content (API keys, tokens, passwords).
Audit Metadata