REA Firmware, IoT, EVM & Signal Reverse Engineering Skill

Scope & Authorization

Covers all first-party reverse engineering tasks beyond standard desktop/web/mobile apps, including embedded firmware images, bootloaders, RTOS binaries, EVM smart contracts, and digital signal recordings.

Execution Pipeline

1. Firmware & Embedded Systems (inspect_firmware_regions, extract_firmware):
   • Identify partition tables, bootloader headers (U-Boot), compressed filesystems (SquashFS, CramFS, JFFS2, LittleFS), and bare-metal load addresses.
   • Disassemble ARM Cortex-M/A, MIPS, RISC-V, Xtensa (ESP32), or AVR code using REA MCP (open_binary, list_procedures, procedure_pseudo_code) and Rizin/Ghidra.
   • Reconstruct peripheral MMIO register maps (UART, SPI, I2C, GPIO, DMA) and clean C/Rust embedded firmware projects (Cargo.toml / CMakeLists.txt / Makefile).
2. Smart Contracts & EVM Bytecode (inspect_evm_interface):
   • Extract 4-byte function selectors, event topic hashes, storage slot layouts, and access control modifiers, and reconstruct clean, verified Solidity (.sol) contracts with Foundry/Hardhat tests.
3. RF & Signal Recording Analysis (decode_signal_recording, inspect_signal_decoders):
   • Decode captured digital/RF signal recordings, frame preambles, modulation parameters, and payload structures.