pie-thermal-engineering
Installation
SKILL.md
Thermal Engineering Skill
At a Glance
Calculate heat transfer rates, size heat exchangers, and analyze data center thermal performance from component-level junction temperatures to facility-wide efficiency metrics.
Activation: InfrastructureRequest type='thermal', any heat exchanger sizing request, PUE/WUE calculation, airflow management design, or cooling load analysis.
Key capabilities:
- Three-mode heat transfer: conduction (Fourier), convection (Newton), radiation (Stefan-Boltzmann)
- Thermal resistance networks (series/parallel, analogous to electrical circuits)
- Data center cooling load breakdown (IT, UPS, lighting, fans, envelope)
- Heat exchanger sizing via LMTD and epsilon-NTU methods
- PUE/TUE/WUE/CUE efficiency metric calculations with target benchmarks
- Airflow management: hot/cold aisle containment, raised floor, economizer modes
Integration: Works in tandem with pie-fluid-systems: the fluid skill sizes cooling loop pipes and pumps; this skill quantifies the heat and determines exchanger performance.